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Journal of Statistical Software
Research Hotspot & Journal Scope - Package


Journal of Statistical Software - DOI: 10.18637/JSS.V091.I02
stm: R Package for Structural Topic Models

Margaret E. Roberts · Brandon M. Stewart · Dustin Tingley ·

Computer Science
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Journal of Statistical Software - DOI: 10.18637/jss.v089.i12
Hyperspectral Data Analysis in R: The hsdar Package

Lukas W. Lehnert · Hanna Meyer · Wolfgang A. Obermeier · Brenner Silva · Bianca Regeling · Jorg Bendix ·

Computer Science Mathematics
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Journal of Statistical Software - DOI: 10.18637/JSS.V088.I07
CoClust: A Python Package for Co-Clustering

François Role · Stanislas Morbieu · Mohamed Nadif ·

Computer Science
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Journal of Statistical Software - DOI: 10.18637/JSS.V088.I08
plssem: A Stata Package for Structural Equation Modeling with Partial Least Squares

Sergio Venturini · Mehmet Mehmetoglu ·

Computer Science
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Journal of Statistical Software - DOI: 10.18637/JSS.V088.I04
The R package MAMS for designing multi-arm multi-stage clinical trials

Thomas Jaki · Philip Pallmann · Dominic Magirr ·

Computer Science
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A fully packaged switch with input/output fibers is tested both for optical and electrical characteristics as well as for the system performances.

Integrated Reconfigurable Silicon Photonics Switch Matrix in IRIS Project: Technological Achievements and Experimental Results [10.1109/JLT.2018.2871974]


Influence of ultrasound treatment on microorganisms and the quality of modified atmospheric packaged fresh-cut cucumber during storage were investigated.

Ultrasound treatment to modified atmospheric packaged fresh-cut cucumber: Influence on microbial inhibition and storage quality. [10.1016/j.ultsonch.2019.02.003]


During harvest fruit were directly placed into their storage packages (into nespacks) and stored at 3 ± 1 °C for 20 days in cold storage condition.

Postharvest logistics performance of fresh fig varieties in Turkey [10.1016/J.SCIENTA.2019.108769]


Photo-sensitive dielectric materials applicable to advanced organic interposers are desired to realize cost-effective semiconductor packages equipped with fine patterning capability.

Development of Novel Photosensitive Dielectric Material for Reliable 2.1D Package [10.1109/ECTC.2019.00158]


The films developed showed potential to be applied as food package.

Technological viability of biobased films formulated with cassava by‐product and Spirulina platensis [10.1111/JFPE.13136]


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