Flexible Mems(灵活的内存)研究综述
Flexible Mems 灵活的内存 - The analytical results proved that the E-VUV process was applicable to PEEK-and tin-polyimide bonding, and the bonded interfaces are expected to be robust enough for flexible MEMS packaging. [1] Obviously, the deformation of flexible substrate inevitably affects the performance of flexible MEMS devices. [2]分析结果证明,E-VUV 工艺适用于 PEEK 和锡聚酰亚胺键合,并且键合界面有望足够坚固,可用于柔性 MEMS 封装。 [1] 显然,柔性基板的变形不可避免地影响柔性MEMS器件的性能。 [2]