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Experimental measurements of the shear force on surface mount components simulating the wave soldering process


Challenges in Minimizing Copper Dissolution for Lead Free Wave Soldering in Surface Mount Technology Going Towards Green Manufacturing


Influence of Laser Soldering Temperatures On Thru-Hole Component



Numerical Modeling of the Wave Soldering Process and Experimental Validation



Finite-Element Analysis of Strain Distribution in Ceramic Multilayer Capacitors during Wave Soldering and Reflow Soldering



Identification of essential factors causing solder bridging of right-angle solder interconnects in laser jet solder ball bonding process



Effect of filling level and fillet profile on pin-through-hole solder joint


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