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Experimental measurements of the shear force on surface mount components simulating the wave soldering process

Challenges in Minimizing Copper Dissolution for Lead Free Wave Soldering in Surface Mount Technology Going Towards Green Manufacturing

Influence of Laser Soldering Temperatures On Thru-Hole Component

Numerical Modeling of the Wave Soldering Process and Experimental Validation

Finite-Element Analysis of Strain Distribution in Ceramic Multilayer Capacitors during Wave Soldering and Reflow Soldering

Identification of essential factors causing solder bridging of right-angle solder interconnects in laser jet solder ball bonding process

Effect of filling level and fillet profile on pin-through-hole solder joint

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