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10.1108/ssmt-06-2021-0034

Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process


10.1007/s40194-021-01118-y

Soldering Zr metallic glass to Ti alloy using pre-cladding ultrasonic processes


10.1016/J.JMAPRO.2021.02.003

Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering



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10.1080/13621718.2021.1882147

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder


10.3390/s21020545

Automatic Joining of Electrical Components to Smart Textiles by Ultrasonic Soldering


10.3390/ma14216369

Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite


10.1007/s40194-019-00758-5

Investigation of ultrasound-assisted soldering of SiC ceramics by Zn-Al-In high-temperature solder


10.1016/j.ultras.2019.106003

Acoustic analysis of ultrasonic assisted soldering for enhanced adhesion.


10.1142/S0217979219400277

Microstructure evolution and mechanical properties of 6N01S-T5 aluminum alloy joints with semi-solid solders by ultrasonic soldering


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