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By contrast, Si3N4 and Ti thin films of high elastic modulus were deposited on GaAs and glass substrates of low elastic modulus, respectively.
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We impinge a circularly polarized Gaussian beam on TI thin film substrate and calculate the lateral and angular GH shifts under partial reflection conditions.
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Ti Thin sentence examples within ti thin layer
These systems of mirrors are constructed for an event angle from 0° to 45° and are modeled with interference filters-like multi thin layer dielectric coatings.
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To do that, several Cu and Ti thin layers were alternatively deposited by Ar + sputtering on silicon wafers and, subsequently, oxidized by thermal annealing.
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By contrast, Si3N4 and Ti thin films of high elastic modulus were deposited on GaAs and glass substrates of low elastic modulus, respectively.
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We impinge a circularly polarized Gaussian beam on TI thin film substrate and calculate the lateral and angular GH shifts under partial reflection conditions.
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ABSTRACT Crystallite-size-dependent lattice expansion of the hcp Ti phase has been observed by X-ray diffraction of polycrystalline Ti thin films.
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ABSTRACT NiTi thin sheets were ultrasonic spot welded with a Cu interlayer, where different welding vibration amplitudes were applied to study the influence on the surface and interface microstructural characteristics, phase transformation behavior and mechanical response of the joints, which aimed to enhance the joint performance by proper optimization of the process parameters.
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However, previous reports have only demonstrated inefficient wavefront control based on binary metasurfaces that were digitalized on a TI thin film or non-directional surface plasmon polariton (SPP) excitation.
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These systems of mirrors are constructed for an event angle from 0° to 45° and are modeled with interference filters-like multi thin layer dielectric coatings.
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The sputtered a-Si/Ti thin-film was characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), and UV–visible absorption spectroscopy.
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This essay begins to explore the philosophical grounds on which Chinese literati thinkers came to legitimate, and in some cases value, alternative ways of life in the early modern era (sixteenth and seventeenth centuries).
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Experimentally, nanotwinned Ag films with thicknesses ranging from 2 to 8 µm and a strong (111) preferred orientation were sputtered on Si (100) wafers with and without a Ti thin film.
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In the present work, the microstructural characteristics, martensitic transformation behavior, and mechanical performance of NiTi thin films irradiated with different proton fluences were investigated.
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Here, we report on the magnetic-field induced helicity dependent photogalvanic effect (MHPGE) of 3D TI thin films Bi 2Te 3 or (Bi xSb 1−x) 2Te 3 of different thicknesses excited by near-infrared (1064 nm) under an in-plane magnetic field.
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An inert thick YSZ microtubular substrate with radially well-aligned microchannels open at the inner surface is used to support multi thin functional layers of solid oxide cell, i.
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To do that, several Cu and Ti thin layers were alternatively deposited by Ar + sputtering on silicon wafers and, subsequently, oxidized by thermal annealing.
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After cold plasma treatment to enhanced adhesion, Ti thin films were deposited by planar magnetron sputtering and TiO2 thin films by reactive magnetron sputtering in an Ar-O2 gas atmosphere.
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We propose an ultra-wideband (UWB) solar energy absorber composed of a Ti ring and SiO2-Si3N4-Ti thin films.
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Nanoscale NiTi thin films are highly suitable for high frequency thermal actuation in microelectromechanical devices because of their small thermal mass and large surface-to-volume ratios.
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In the present paper the development of surface morphology of double layered Cu/Ti thin film heterostructure with different composition and thickness has been studied by using the phase field method.
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The formation of laser-induced periodic surface structures (LIPSS) on Ti thin films, their phase and stoichiometric evolution, as a function of well below ablation threshold laser fluence, and the number of pulses, is investigated.
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The results demonstrate that grain growth is significantly suppressed in the UFG pure Ti thin film compared to bulk material.
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Cu-TiO2 doped Ti thin layer was prepared by anodizing and electrodeposition.
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The purpose of this work is to assess the crystallization kinetic properties of the direct current (DC) magnetron sputtered NiTi thin films.
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Among several types of fabrication techniques for NiTi thin films, magnetron sputtering, which yields a better homogeneous film, has been discussed.
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The influence of oxygen diffusion phenomena of the bottom layer of TiO2 to the upper layer of Ti thin films at different oxidation temperatures on structural, optical, and photocatalytic performance was investigated.
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We have studied the characteristics of different metastable states in NbTi thin film deposited on sapphire substrate in a region very close to the transition temperature T
$$_{c}$$
, which was estimated to be about 7.
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NiTi thin films showed superplasticity with recovery strain up to 8%, however their strongly non-linear elasticity caused imprecise position control in MEMS requiring immediate and progressive control.
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The average particle size of the CoTi thin films was calculated using the Atomic Force Microscopy image.
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9 or 20GDC) sandwiched between two Ti thin-film metal contacts.
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The present investigations is based on annealing heat treatment of co-sputtered Ni–Ti thin films and its effect on structure, morphology, composition, phase formations, intermetallic precipitate formation, and nano-mechanical properties.
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Meanwhile, the hysteresis loops at ambient temperature demonstrate that in Ni-Co-Mn-Ti thin films the ferromagnetic contribution increases at the expense of diamagnetic one as DT increases.
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2–3 nm of in situ deposited Al on top of pristine TI thin films immediately oxidizes after taking the sample to ambient conditions.
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We experimentally analyze different growth regimes of Ti thin films associated to the existence of kinetic energy-induced relaxation mechanisms in the material's network when operating at oblique geometries.
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Silicon wafers with Ti thin films (thickness: 40 nm) covered with Au thin films (thickness: 4 nm) as passivation layers were bonded at room temperature by surface activated bonding.
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First, Giannotti thinks that the standard version of the powerful qualities view can be differentiated from the pure powers view.
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In this paper, Ti thin films were prepared by high-power pulsed magnetron sputtering, and the texture of Ti t.
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We employ micro-Raman and tip-enhanced Raman spectroscopy to examine three different mechanisms of symmetry breaking in Bi2Te3 TI thin films: surface plasmon generation, charge transfer, and application of a periodic strain potential.
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NiTi thin films with robust shape memory effects and low deposition temperatures are greatly desired for microelectronic devices.
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0 nm s−1 agreed very well with the experimental data of the deposited Mo and Ti thin films.
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The persistent charge current on the ring of the TI thin film changes sign from positive to negative approaching maximal saturated values at large magnetic fluxes.
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A particular wafer processing step involves deposition of a Ti thin film (˜6 nm to ˜13 nm) on Si, under processing conditions intended to form a silicide with specific electrical properties.
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Here, we report on the selective area growth of (Bi,Sb)2Te3 TI thin films and stencil lithography of superconductive Nb for a full in situ fabrication of S–TI hybrid devices via molecular-beam epitaxy.
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In order to check the capability of the platform, with regard to new material classes and applications, we performed measurements of the electrical conductivity σ, thermal conductivity λ and Seebeck coefficient S of two 100 nm Au and Ti thin film samples with considerably larger thermal and electrical transport values.
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Within the current work, MoAlTi thin films have been developed and deposited by d.
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Using molecular beam epitaxy for the growth of doped (Sb,Bi)2(Se,Te)3 TI thin films, high doping concentrations can be achieved while preserving their high crystalline quality.
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A promising avenue of research for the development of functional TI devices has involved doping of three-dimensional (3D) TI thin film and bulk materials with magnetic elements.
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A new anode material of Sn-Ti thin film was successfully prepared by magnetron co-sputtering of two separate targets at the atmosphere of Ar at normal temperature.
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The NiTiCu film can be used for Micro Electro Mechanical System (MEMS) application considering the power requirement will be low when compared to NiTi thin film and also can be used for various applications.
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, oxygen-free Pd/Ti thin film, for evacuating residual H2 and CO.
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The electrochemical studies of the Ti thin films coated at a lower working pressure (0.
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Oxygen-free Pd/Ti thin films have been developed as novel nonevaporable getter coatings for ultrahigh vacuum (UHV) chamber walls, which can maintain high pumping speed even after many cycles of air-vent and only require activation at a relatively low temperature of 133 ° C.
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Surface properties of Ti thin films prepared via radio frequency (RF) magnetron sputtering at various deposition times are investigated by fractal analyze.
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Ti thin films were deposited on the AlN substrates by direct-current magnetron sputtering at temperatures ranging from room temperature to 450 °C.
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WO3:Mo and WO3:Ti thin films have been deposited on FTO/Glass substrates by the pulsed chemical spray technique at a substrate temperature of Ts = 450°C.
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According to the results of the study, the performance of SBTi thin films are improved by suitable Ca doping.
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As compared to the pure Cu and Ti thin films, the prepared composite exhibited improved hardness and better elasticity reflected in lower values of the Young's modulus.
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Rapid, low-cost preparation of large-area TI thin films compatible with conventional semiconductor technology is key to the practical applications of TIs.
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In this research, glassy Ni–Ti thin films were sputtered on a flexible substrate (Kapton) using direct current (DC) magnetron sputtering system at ambient temperature.
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We deposited the AlN on Si (100), Si (111), amorphous SiO2, and a (001) preferentially oriented Ti thin film and compared their crystallographic, optical, and piezoelectric properties.
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In this work, cohesive and adhesive properties of Ti thin films on polyimide substrates were studied systematically as a function of grain size by in situ optical microscopy, resistance measurements and synchrotron X-ray diffraction under uniaxial tensile testing.
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The Ti/TiO2 junction is prepared by controlled oxidation of a Ti thin film, previously deposited on a fused silica substrate.
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Geometrically graded superelastic NiTi thin plates with series and parallel design configurations with respect to the loading direction have been created.
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